Team Xtreem DDR3 2666
LV Series ( Black thick Heatspreader) For Gamers & Overclocking
Different levels of performance experiences for users
For Team Xtreem family, Team Group Inc. adopts high quality ICs selected particularly, such that it has excellent over-clocking capability with strict quality examination through strict test and verification procedures. Large capacity memory module design satisfies the requirement of 3D drawing multimedia workers, such that the operation is smooth and rapid when a large amount of applications and media files are opened to meet the requirement of over-clocking users for various multimedia and gaming applications. Multi-level great and dazzling heat sink modeling is used for Team Xtreem family. Heat dissipation efficiency is enhanced through large area heat dissipation fin. With additional mount of the latest V1.3 Intel XMP, the product provides better support and is the best selection for professional users requiring extreme performance.
|Team Gaming and OC Module LV Series ( Black thick Heatspreader) DDR3|